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Dongyichang

Shenzhen Dongyichang Technology Co., Ltd

15 years of dedicated PCBA manufacturing, SMT+DIP, and comprehensive testing services

Contact:+86-135-3239-0979
Email: sales@dyc-pcba.com
SMT processing
Attention to detail is the guarantee of success
  • Material preservation

    The storage environment of materials directly affects the reliability of the soldering process of the product, strictly control the temperature and humidity and regularly check the equipment to ensure product quality!

  • Solder paste printing inspection

    Adopting advanced solder paste printing and testing equipment to detect the height, area, volume and displacement of tin to ensure the precision of solder paste printing.

  • Anti static

    We use materials that meet the anti-static properties to revolve, store and package all products, and adopt isolation measures to prevent damage.

  • SMT first test

    Refer to Bom and gerber data to measure and test each material of the first board, ensure that the components attached to the production model are fully compliant with customer requirements, so as to prevent undesired flow into the next process.

  • Product function test

    For products that need to be functionally tested, 100% full inspection is performed, and quality inspectors are arranged to conduct uninterrupted inspections to prevent false and missed inspections.

  • QA shipment inspection

    According to the process instructions of various products and various job guidances, all the production processes shall be spot-checked to ensure packaging and shipment after passing the inspection.

SMT Processing Product Cases
Advanced production equipment

DYC core equipment

Advanced equipment, resulting in excellent quality.

With advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.

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DYC core equipment

Advanced equipment, resulting in excellent quality.

With advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.

View more devices

DYC core equipment

Advanced equipment, resulting in excellent quality.

With advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.

View more devices

DYC core equipment

Advanced equipment, resulting in excellent quality.

With advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.

View more devices
Processing flow chart
07.
Solder paste printing
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Processing flow chart

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Shenzhen Dongyichang Technology Co., Ltd

Address: 2F, Building 3, Yayuan Industrial Park, Yuhe Road, Gonghe Community, Shajing Street, Baoan District, Shenzhen, China

Contact person: Mr. Andy Huang

TEL: +86-135-3239-0979

          +86 0755-23721406

Email:sales@dyc-pcba.com

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