The storage environment of materials directly affects the reliability of the soldering process of the product, strictly control the temperature and humidity and regularly check the equipment to ensure product quality!
Adopting advanced solder paste printing and testing equipment to detect the height, area, volume and displacement of tin to ensure the precision of solder paste printing.
We use materials that meet the anti-static properties to revolve, store and package all products, and adopt isolation measures to prevent damage.
Refer to Bom and gerber data to measure and test each material of the first board, ensure that the components attached to the production model are fully compliant with customer requirements, so as to prevent undesired flow into the next process.
For products that need to be functionally tested, 100% full inspection is performed, and quality inspectors are arranged to conduct uninterrupted inspections to prevent false and missed inspections.
According to the process instructions of various products and various job guidances, all the production processes shall be spot-checked to ensure packaging and shipment after passing the inspection.
With advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.
View more devicesWith advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.
View more devicesWith advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.
View more devicesWith advanced production equipment and testing equipment, BGA mounting range is 0.18MM-0.4MM. The minimum placement material package is 01005, Japan automatic SMT production line, daily production capacity of 3 million points and top quality control testing equipment, 9 “testing procedures” are strictly controlled, 2600 square high standard anti-static and dust-free production workshop.
View more devicesShenzhen Dongyichang Technology Co., Ltd
Address: 2F, Building 3, Yayuan Industrial Park, Yuhe Road, Gonghe Community, Shajing Street, Baoan District, Shenzhen, China
Contact person: Mr. Andy Huang
TEL: +86-135-3239-0979
+86 0755-23721406
Email:sales@dyc-pcba.com
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